德律TR7700QE SII介紹：
The TR7700QE SII AOI offers high performance 3D solder and assembly inspection by combining the next generation Inspection technologies based on multiple 3D Technologies. The TR7700QE SII is equipped with the Depth-from-Focus Module, which reduces the Operator's Re-Inspection and also reducing false calls. Due to its versatility, the TR7700QE SII can serve as Pre-Reflow or Post-Reflow depending on the production line needs.
德律TR7700QE SII特性：
1. Ease of Programming with TRI's Smart Library
2. Industry-Leading Speed, up to 57 cm2/sec
3. Multiple 3D Technologies: Zero-escapes Inspection
德律TR7700QE SII規(guī)格：
Optical System
| Imaging Method | Stop-and-Go |
| Top Camera | 12 MP High Speed Camera |
| Angle Camera | N/A |
| Imaging Resolution | 10 μm, 15 μm (factory setting) |
| Lighting | Multi-Phase True Color Led, Coaxial Lighting |
| 3D Technology | Quad Digital Fringe Pattern Projector |
| Max. 3D Range | 40 mm |
Inspection Performance
| Imaging Speed | @ 10 μm: 25 cm2/sec @ 15 μm: 57 cm2/sec Note: The inspection time will vary depending on the configuration |
Motion Table & Control
| X-Axis Control | Ballscrew + AC Servo with Motion Controller |
| Y-Axis Control | Ballscrew + AC Servo with Motion Controller |
| Z-Axis Control | Ballscrew + AC Servo with Motion Controller |
| X-Y Axis Resolution | 1 μm with Optional Linear Encoder |
Board Handling
Inspection Functions
| Component | Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material |
| Solder | Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger Scratch/ Contamination |
