德律TR7007D介紹：
TR7007D SPI建基于最新的3D投影技術(shù)，以最具成本效益的解決方案提供優(yōu)異的檢驗性能。TR7007D在線型檢測系統(tǒng)，可自動優(yōu)化檢查路線以提供絕佳的性能表現(xiàn)。且TRI創(chuàng)新的智能板彎補償系統(tǒng)可彌補檢查過程中的板彎。搭配雙光源數(shù)字條紋投影檢測，TR7007D是最可靠的SPI解決方案，可以極具競爭力的價格提供精確的檢測效能。
德律TR7007D特性：
1.100％無陰影的雙光源/四光源數(shù)位條紋投影檢測
2.優(yōu)化的走停式設(shè)計最大精度
3.智能板彎補償可免除PCB變形的問題
4.100％的錫膏缺陷覆蓋率，低錫橋亦可檢出
德律TR7007D規(guī)格：
Optical System
| Imaging Method | Stop-and-Go Imaging |
| Camera | 4 Mpix or 12 Mpix (factory setting) |
| Imaging Resolution | 6 μm, 10 μm , 15 μm (factory setting) |
| Lighting | RGB True Color LED |
| 3D Technology | 2-way Digital Fringe Pattern |
| Field of View | 4 Mpix@ 10 μm: 20.3 x 20.3 mm 4 Mpix@ 15 μm: 30.5 x 30.5 mm 12 Mpix@ 6 μm: 24.4 x 18.4 mm* 12 Mpix@ 10 μm: 40.8 x 30.7 mm 12 Mpix@ 15 μm: 61.2 x 46.1 mm * 6 μm is not available for TR7007D DL |
Inspection Performance
| Imaging Speed | 4 Mpix: 3 FOV/sec 12 Mpix: 2 FOV/sec 12 Mpix CoaXPress: 3 FOV/sec* Note: Inspection speed depends on PCB and inspection conditions * With optional CoaXPress upgrade |
| Height Resolution | @ 6 μm: 0.22 μm @ 10/15 μm: 0.4 μm |
| Max. Solder Height | @ 6 μm: 210/420 μm @ 10/15 μm: 420/840 μm |
Motion Table & Control
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | Ballscrew + AC-servo controller |
| X-Y Axis Resolution | 1 μm (up to 0.5 μm with optional linear encoder) |
| Z-Axis Resolution | 1 μm (up to 0.5 μm with optional linear encoder) |
Board Handling
| Max PCB Size | TR70007D: 510 x 460 mm* TR7007Q DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane * 6 μm is only available for TR7007D, the Max. PCB size is 330 x 310 mm |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm |
| Conveyor Height | 880 – 920 mm * SMEMA Compatible |
Inspection Functions
| Defects | Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
| Measurement | Height Area Volume Offset |
